It includes underfloor and overhead integrated liquid cooling designs, hybrid air cooling and liquid cooling, and advanced schemes for heat recovery and energy storage.
Today’s AI data centers face unprecedented cooling challenges. The latest GPUs and CPUs generate significantly more heat than before, while rack densities continue to climb as more processing units are packed into tighter spaces. With rack power consumption exceeding 30 kW, traditional air cooling alone cannot dissipate heat efficiently enough to maintain safe operating temperatures in these environments.