The Multi Scenario Modular AIDC Solution is a set of reference architectures designed for AI data centers built around high-power GPU racks. Today’s AI data centers face unprecedented cooling challenges: the latest GPUs and CPUs generate significantly more heat than their predecessors, while rack densities continue to climb. With rack power often exceeding 30 kW per cabinet, traditional air cooling reaches its physical limits.
In EPG’s approach, cold plate liquid cooling (direct-to-chip) becomes the primary cooling technology, removing about 75–80% of the heat load from GB200 NVL72-class racks, with the remaining 20–25% handled by air-cooling systems. EPG demonstrates four different scenario solutions (“Zones”) that integrate power, cooling and IT PODs to address a variety of site conditions.