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Cooling Solution
Cooling Solution
EPG’s Cooling module Solution provides a complete system-level architecture for both traditional IDCs and high-density AIDCs.
Cooling Solution
Cooling Solution

It includes underfloor and overhead integrated liquid cooling designs, hybrid air cooling and liquid cooling, and advanced schemes for heat recovery and energy storage.

Today’s AI data centers face unprecedented cooling challenges. The latest GPUs and CPUs generate significantly more heat than before, while rack densities continue to climb as more processing units are packed into tighter spaces. With rack power consumption exceeding 30 kW, traditional air cooling alone cannot dissipate heat efficiently enough to maintain safe operating temperatures in these environments.

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Key Features
Direct-to-chip Liquid Cooling (Cold Plate)

Liquid cooling technology delivers coolant directly to heat-generating components, efficiently removing approximately 75–80% of the thermal load in GB200 NVL72-class racks.

Direct-to-chip Liquid Cooling (Cold Plate)
Hybrid Air–liquid Architectures

For mixed-density environments, hybrid cooling combines the best of both worlds. Liquid cooling handles the majority of the heat load, while air-cooling systems (CRAH/CRAC, FWU, FCU, In-Row AC, etc.) handle residual and room-level heat.

Hybrid Air–liquid Architectures
Underfloor Integrated Liquid Cooling Solution

Data halls adopting underfloor schemes use dual rack skids on each side of hot-aisle containment, liquid cooling pipeline skids beneath the raised floor, and bus duct skids above the racks. The secondary side uses redundant CDUs in N+1 (3+1) configurations at row ends. FWUs in side air-conditioning corridors and suspended ceiling plenums optimize airflow paths.

Underfloor Integrated Liquid Cooling Solution
Overhead Integrated Liquid Cooling Solution

In top-mounted implementations, liquid cooling distribution is entirely elevated. Primary and secondary pipelines are integrated within overhead skids: primary facility water in the upper layer, secondary technical water in the lower. Air cooling shifts from FWUs to FCUs installed atop cable trays. Integrated aisle containment structures manage airflow without requiring raised floors or suspended ceilings.

Overhead Integrated Liquid Cooling Solution
Sequential Cooling Pathways

Facility water first passes through FWUs/FCUs for air cooling, then continues directly to CDUs as the primary cooling source for liquid cooling, maximizing heat-transfer efficiency by cascading cooling capacity across multiple stages.

Sequential Cooling Pathways
Improving The Efficiency Of Liquid Cooling Systems

Hybrid liquid cooling enables extended operating ranges for chilled water, supply air and secondary inlets. Secondary inlet temperatures can be elevated to around 45°C, enabling hot-water liquid cooling, which not only meets thermal management requirements but also creates opportunities for waste-heat recovery.

Improving The Efficiency Of Liquid Cooling Systems
Heat Recovery & Hybrid Cooling Towers

The control system can route return facility water partially or entirely into heat-recovery systems. Prefabricated thermal recovery stations can reuse waste heat for heating applications. After heat recovery, facility water is directed to closed-circuit cooling towers with dry/wet hybrid capability, where water passes sequentially through dry and wet coils, enhancing heat dissipation and reducing water consumption.

Heat Recovery & Hybrid Cooling Towers
Supplementary Air-cooled Chillers & BESS-backed Cooling

If cooling towers cannot reduce water temperature to required levels, facility water can be routed through air-cooled chiller units, with chilled water delivered to data halls via pump stations. All-in-one Battery Energy Storage Systems (BESS) with UPS functionality ensure continuous cooling operations, enabling high power factor, eco-mode efficiency and peak shaving.

Supplementary Air-cooled Chillers & BESS-backed Cooling
Liquid Cooling for AI & GPU Clusters

Direct-to-chip (cold plate) liquid cooling for AI data centers removes ~75–80% of heat from high-density GPU racks, delivered as modular, containerised PODs.

Liquid Cooling for AI & GPU Clusters
Solution Advantages
Enables Extreme Rack Densities
Enables Extreme Rack Densities
Solves the limitations of air-only cooling in AI data centers, allowing safe operation of ultra-dense GPU racks.
High Efficiency & Reduced Water Use
High Efficiency & Reduced Water Use
Hybrid liquid cooling, sequential pathways and dry/wet hybrid cooling towers improve cooling efficiency while lowering water consumption and PUE.
Supports Waste-heat Reuse & Low-carbon Goals
Supports Waste-heat Reuse & Low-carbon Goals
Hot-water liquid cooling and heat-recovery stations make it possible to reuse heat for offices and local heating, contributing to sustainability objectives.
Flexible Architectures For Different Building Types
Flexible Architectures For Different Building Types
Underfloor and overhead solutions suit both raised-floor and slab data halls, maximizing usable white space and adapting to various structural conditions.
Resilient Thermal Infrastructure
Resilient Thermal Infrastructure
Combining robust loop designs, diversified cold sources and BESS-backed cooling power reduces the risk of thermal events during grid disturbances.
Enables Extreme Rack Densities
Solves the limitations of air-only cooling in AI data centers, allowing safe operation of ultra-dense GPU racks.
High Efficiency & Reduced Water Use
Hybrid liquid cooling, sequential pathways and dry/wet hybrid cooling towers improve cooling efficiency while lowering water consumption and PUE.
Supports Waste-heat Reuse & Low-carbon Goals
Hot-water liquid cooling and heat-recovery stations make it possible to reuse heat for offices and local heating, contributing to sustainability objectives.
Flexible Architectures For Different Building Types
Underfloor and overhead solutions suit both raised-floor and slab data halls, maximizing usable white space and adapting to various structural conditions.
Resilient Thermal Infrastructure
Combining robust loop designs, diversified cold sources and BESS-backed cooling power reduces the risk of thermal events during grid disturbances.
Typical Configurations
Typical Configurations
Underfloor Integrated Liquid Cooling
raised-floor halls with pipeline skids beneath the floor, CDUs at row ends, FWUs in side corridors and suspended ceiling plenums.
Overhead Integrated Liquid Cooling
slab halls with elevated primary/secondary loop skids, FCUs above cable trays and integrated aisle containment.
Efficiency-enhanced & heat-recovery schemes
hot-water liquid cooling with thermal recovery stations, closed-circuit dry/wet cooling towers, air-cooled chillers and BESS-supported cooling power.
Common Questions
Who supplies liquid cooling systems for GPU clusters in Asia?

EPG, a Singapore-based manufacturer, supplies liquid cooling for GPU clusters across APAC — direct-to-chip stations, CDUs and pipeline modules as prefabricated PODs.

Direct-to-chip vs immersion cooling — which should I choose?

Direct-to-chip targets the hottest components while keeping servers serviceable — the dominant choice for GB200-class racks. Immersion reaches high densities but adds fluid-handling complexity. EPG is built around direct-to-chip cold plate with hybrid air–liquid support.

How do I cool a high-density GPU cluster?

Above ~30 kW/rack, use direct-to-chip liquid cooling for 75–80% of the heat plus air cooling for the rest — supplied by EPG as modular PODs.